Coating Systems - Auto 500

Sputtering System
Magnetron sputtering systems can be used to deposit virtually all metals, alloys and compounds and offer some distinct advantages over thermal evaporation techniques:

• Constant composition for materials that tend to dissociate
  
• No contamination from crucibles, filaments or boats
  
• Minimizes substrate heating and promotes superior adhesion
  
• Achieves higher deposition rates and denser film structures

BOC Edwards advanced magnetron designs offer fast deposition rates, i.e. up to 2 microns per minute can be achieved for copper.

Using the dual gas control system, compounds can be deposited by reactive sputtering. Control of gas pressure, gas ratios and gas flow rates allow the sputtering processes to be reproducibility controlled easily giving reproducible results.

The Auto 500 provides economic sputter etching by utilizing a power selector switch to divert power from the main sputtering power supply to the substrate holder, avoiding the need for an additional power supply. Substrates can have a DC or RF bias potential applied during sputtering to modify film properties and to alter surface chemical reactivity or net deposition rates. Biasing affects film morphology dramatically and can be used to control film stoichiometry.