The newly designed BCD-2800 and FC-2800A provide an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 and FC-2700A load lock evaporation systems. These mid-sized systems offer tooling options that support either lift off or conformal (step coverage) processes, with lift off tolling enabling the customer to process up to twenty-five 4" wafers in a single processing cycle.
The BCD-2800 features a box type product chamber mounted over a BJD-2000 source body and replaces the VES-2550 in our product line. The FC-2800A, an update to the FC-2700, provides improved installation flexibility. Both systems feature high throughput 16" cryogenic pumps mounted on the product chamber. The FC-2800A offers load lock isolation of the product and source chambers and an additional 8" cryo pump that keeps the source chamber at high vacuum during wafer loading and unloading.
Additional* Features
- 28" (711mm) square process chamber with 34" (866mm) source to substrate distance
- Load lock source isolation valve between process chamber and source chamber (FC-2800A only)
- CTI-16 "on-board" cryo pump mounted on product chamber
- Additional CTI-8 "on-board" cryo pump for independent source chamber pumping (FC-2800A only)
- Source tray with single or multi-pocket e-beam sources and/or one or more thermal evaporation sources
- 6kW CV-6SL or 15kW Simba power supply
Additional* Options
- 8kW substrate heat
- 42" (1067mm) source to substrate extension collar (lift off option only)
- In vacuum flip and variable angle substrate fixtures
*Standard Features & Options on Overview Page
Download FC-2800A Datasheet
Temescal products are available through BOC Edwards Temescal
Phone (925) 371-4170
Fax (925) 449-4096
Email info@bocedwards.com