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The FC-4400A represents our largest scale design lift off oriented evaporation and our ultimate in high throughput platform. This system is designed to support the metallization of thirty 6" wafers per load via high capacity e-beam evaporation. The load locked, 44"x44"x28" product chamber can be pumped by as many as two dedicated, high throughput 16" cryogenic pumps. The dual-cryo pump option makes it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10" cryo pump.
Additional* Features
- 44"x 44"x28" (711mm) process chamber with 38" (965mm) source to substrate distance
- Load lock source isolation valve between process chamber and source chamber
- A side flange permitting the field addition to the additional load locked wafer exchange chamber
- Custom fixturing option for fibers, laser facets, or MEMs
- A dedicated CTI-16 "on-board cryo pump on the product chamber
- A dedicated CTI- 10 "on-board" cryo pump on the source chamber
- TP-8 dome fixture for lift off coating of up to thirty 6" wafers per load
- Source tray with single or multi-pocket source and/or one or more thermal evaporation sources
- Simba (15kW) power supply
Additional* Options
- An additional CTI-16 mounted on the product chamber, providing rapid pump down and allowing that chamber to remain at high vacuum while one of the cryo pumps is regenerated
- 8kW substrate heat
- 42" (1067mm) source to substrate extension collar
*Standard Features & Options on Overview Page
Download FC-4400 Datasheet
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